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MAX1921EUT Rev. A
RELIABILITY REPORT FOR MAX1921EUT PLASTIC ENCAPSULATED DEVICES
April 30, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Reliability Lab Manager
Bryan J. Preeshl Quality Assurance Executive Director
Conclusion The MAX1921 sucessfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments
I. Device Description A. General The MAX1921 step-down converter delivers over 400mA to outputs as low as 1.25V. This converter uses a unique proprietary current-limited control scheme that achieves over 90% efficiency. This device maintains extremely low quiescent supply current (50A), and it's high 1.2MHz (max) operating frequency permits small, low-cost external components. This combination makes the MAX1921 an excellent high-efficiency alternative to linear regulators in space-constrained applications. Internal synchronous rectification greatly improves efficiency and eliminates the external Schottky diode required in conventional step-down converters. The device also includes internal digital soft-start to limit input current upon startup and reduce input capacitor requirements. The MAX1921 provides factory-preset output voltages (see the Selector Guide) and is available in space-saving 6-pin SOT23 packages
B. Absolute Maximum Ratings Item IN, FB, SHDN to AGND OUT to AGND, LX to PGND AGND to PGND OUT Short Circuit to GND Operating Temperature Range Junction Temperature Storage Temperature Lead Temperature (soldering 10s) Continuous Power Dissipation (TA = +70C) 6-Pin SOT23 Derates above +70C 6-Pin SOT23 Rating -0.3V to +6V -0.3V to (IN + 0.3V) -0.3V to +0.3V 10s -40C to +85C +150C -65C to +150C +300C 696mW 8.7mW/C
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: Low-Voltage, 400mA Step-Down DC-DC Converters in SOT23 B8 1467 California, USA Philippines, Malaysia or Thailand January, 2002
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: 6-Lead SOT23 Copper Solder Plate Non-Conductive Epoxy Gold (1.3 mil dia.) Epoxy with silica filler # 05-3501-0021 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 60 x 41 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Silicon None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord Bryan Preeshl Kenneth Huening
(Reliablity Lab Manager) (Executive Director of QA) (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 192 x 4389 x 134 x 2 (Chi square value for MTTF upper limit)
Thermal acceleration factor assuming a 0.8eV activation energy = 8.10 x 10-9 = 8.10 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure the reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on lots exceeding this level. The following Burn-In Schematic (Spec. #06-5924) shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The PM02 die type has been found to have all pins able to withstand a transient pulse of 1000V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 250mA.
Table 1 Reliability Evaluation Test Results MAX1921EUT
TEST ITEM TEST CONDITION FAILURE IDENTIFICATION PACKAGE SAMPLE SIZE NUMBER OF FAILURES
Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
134
0
DC Parameters & functionality
SOT
77
0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters 77 0
Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V , or V SS1 SS2 or V SS3 or V CC1 , or V CC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
c.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKET
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B
R = 1.5k C = 100pf
TERMINAL D Mil Std 883D Method 3015.7 Notice 8
ONCE PER SOCKET
ONCE PER BOARD
5K
1 2
8 7
0.1 uF
3 4 6 5
5 OHMS
+5V
0.1 uF
100 uF
5K
DEVICES: MAX1920/1921 PACKAGE: 8-uMAX MAX. EXPECTED CURRENT = 1.5mA
DOCUMENT I.D. 06-5924 REVISION A
DRAWN BY: TEK TAN NOTES:
MAXIM
TITLE: BI
Circuit (MAX1920/1921)
PAGE
2
OF 3

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